PCB Capabilities

ITEM Capability Details Notes
Layer 1~6 layer 1-6 copper layers PCB (Don't support Blind/Buried Vias
Controlled Impedance PCB 4 and 6 layer No extra charge and only accept our default layer stack-up Controlled Impedance PCB Layer Stackup ZXHPCB Impedance Calculator
Material FR-4 ALUMINIUM and FR-4
Max size 62cm*52cm MAX SIZE IS 60*50CM
SOLDER MASK LPI Liquid Photo-Imageable Solder Mask is the most common mask type.
Finished Outer Layer Copper 



Max finished outer layer copper weight is 3oz
Finished Inner Layer Copper 0.5oz(17um) Finished inner layer copper weight is 0.5 oz only.
Dimension Tolerance(Outline) ±0.15mm Dimension Tolerance (Outline) is 0.15mm
Thickness 0.4~3.0mm 0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4/3.0 mm
Thickness Tolerance ( T≥1.0mm) ± 10% Eg. For the 1.6mm board thickness, the finished board thickness ranges from 1.44mm(T-1.6×10%) to 1.76mm(T+1.6×10%)
Thickness Tolerance ( T<1.0mm)(T<1.0mm) ±0.1mm 0.7mm(T-0.1)~0.9mm(T+0.1)
Drill Hole Size 0.25~6.3mm Min. drill size is 0.2mm, Max. drill size is 6.3mm.
Hole Size Tolerance ±0.08mm Eg. For the 0.6mm hole, the finished hole size between 0.52mm to 0.68mm is acceptable.
Min. Trace 3.5mil For Single&Double Layer PCB, the minimum trace width is 5 mil; For Multi Layer PCB, the minimum trace width is 3.5mil.
Min. Spacing 4mil For Single&Double Layer PCB, the minimum spacing is 5 mil; For Multi Layer PCB, the minimum spacing is 4mil.
Min. Via diameter Min Inner Diameter (hole):0.25mm,Min Outer diameter :0.5mm For multilayer pcb: Min Inner Diameter (hole):0.25mm,Min Outer diameter :0.5mm For double layer pcb: Min inner diameter:0.3MM, Min outer diameter :0.6MM
Pad to trace 6mil Minimum distance between and trace is 6mil
Annular Ring 5mil Annular Ring>5mil
Min. Character Width and Height Min character width: 4mil Min Character height: 27.5mil Characters width less than 4mil(0.153mm) will be unidentifiable. Characters height less than 32mil will be unidentifiable.
Trace to Outline(Ship as individual board with Rounting ≥0.2mm Ship as individual board(Rounting): Trace to Outline ≥0.2mm; Ship as panel with V-scoring:  Trace to V-cut line ≥0.4mm
Trace to Outline(Ship as panel with V-scoring ≥0.4mm Ship as panel with V-scoring:Trace to V-cut line ≥0.4mm
Min Strip 3mm Ship as individual board(Rounting):Trace to Outline ≥0.2mm;Ship as panel with V-scoring:Trace to V-cut line ≥0.4mm
Panelization without space 0mm The distance between each pc is 0MM
Panelization with space 1.6mm Make sure the space between boards should be ≥1.6mm, otherwise it will be hard to process for rounting.
Min. Half Hole Diameter 0.8mm Half hole is a special technology, so half hole diameter should be bigger than 0.6mm.
Solder mask opening 0.05mm If need solder mask bridge, it should be more than 4MIL
NOTE 1:Copper Hatching with software Pads Hatching We will apply Copper Hatching if your PCBs designed with software Pads. Pls refer to the picture
NOTE2:Slots designed with software Pads Outline Please use Outline to design if there are many non-plated (NPTH) holes.