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PCB Capabilities

ITEM Capability Details Notes
Layer 1~6 layer 1-6 copper layers PCB (Don't support Blind/Buried Vias
Controlled Impedance PCB 4 and 6 layer No extra charge and only accept our default layer stack-up Controlled Impedance PCB Layer Stackup ZXHPCB Impedance Calculator
Material FR-4 ALUMINIUM and FR-4
Max size 62cm*52cm MAX SIZE IS 60*50CM
SOLDER MASK LPI Liquid Photo-Imageable Solder Mask is the most common mask type.
Finished Outer Layer Copper 

1oz~3oz

(35um~105um)

Max finished outer layer copper weight is 3oz
Finished Inner Layer Copper 0.5oz(17um) Finished inner layer copper weight is 0.5 oz only.
Dimension Tolerance(Outline) ±0.15mm Dimension Tolerance (Outline) is 0.15mm
Thickness 0.4~3.0mm 0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4/3.0 mm
Thickness Tolerance ( T≥1.0mm) ± 10% Eg. For the 1.6mm board thickness, the finished board thickness ranges from 1.44mm(T-1.6×10%) to 1.76mm(T+1.6×10%)
Thickness Tolerance ( T<1.0mm)(T<1.0mm) ±0.1mm 0.7mm(T-0.1)~0.9mm(T+0.1)
Drill Hole Size 0.25~6.3mm Min. drill size is 0.2mm, Max. drill size is 6.3mm.
Hole Size Tolerance ±0.08mm Eg. For the 0.6mm hole, the finished hole size between 0.52mm to 0.68mm is acceptable.
Min. Trace 3.5mil For Single&Double Layer PCB, the minimum trace width is 5 mil; For Multi Layer PCB, the minimum trace width is 3.5mil.
Min. Spacing 4mil For Single&Double Layer PCB, the minimum spacing is 5 mil; For Multi Layer PCB, the minimum spacing is 4mil.
Min. Via diameter Min Inner Diameter (hole):0.25mm,Min Outer diameter :0.5mm For multilayer pcb: Min Inner Diameter (hole):0.25mm,Min Outer diameter :0.5mm For double layer pcb: Min inner diameter:0.3MM, Min outer diameter :0.6MM
Pad to trace 6mil Minimum distance between and trace is 6mil
Annular Ring 5mil Annular Ring>5mil
Min. Character Width and Height Min character width: 4mil Min Character height: 27.5mil Characters width less than 4mil(0.153mm) will be unidentifiable. Characters height less than 32mil will be unidentifiable.
Trace to Outline(Ship as individual board with Rounting ≥0.2mm Ship as individual board(Rounting): Trace to Outline ≥0.2mm; Ship as panel with V-scoring:  Trace to V-cut line ≥0.4mm
Trace to Outline(Ship as panel with V-scoring ≥0.4mm Ship as panel with V-scoring:Trace to V-cut line ≥0.4mm
Min Strip 3mm Ship as individual board(Rounting):Trace to Outline ≥0.2mm;Ship as panel with V-scoring:Trace to V-cut line ≥0.4mm
Panelization without space 0mm The distance between each pc is 0MM
Panelization with space 1.6mm Make sure the space between boards should be ≥1.6mm, otherwise it will be hard to process for rounting.
Min. Half Hole Diameter 0.8mm Half hole is a special technology, so half hole diameter should be bigger than 0.6mm.
Solder mask opening 0.05mm If need solder mask bridge, it should be more than 4MIL
NOTE 1:Copper Hatching with software Pads Hatching We will apply Copper Hatching if your PCBs designed with software Pads. Pls refer to the picture
NOTE2:Slots designed with software Pads Outline Please use Outline to design if there are many non-plated (NPTH) holes.